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Dual mode control of the rotational grinding process ...

2012-1-1  The rotational grinding process is widely used in the production of silicon substrates for semiconductor integrated circuits. The fundamental configuration is regarded as optimum for producing large diameter substrates that meet industry specifications for total thickness variation (TTV) and site flatness (SFQR),.

Dual mode control of the rotational grinding process ...

The rotational grinding process enables the production of substrates to meet the submicron planarity specifications required for micro-fabrication of semiconductor integrated circuits.

Rotational Turning Bypasses Grinding Production

2018-5-20  Rotational turning technology eliminates grinding because of special kinematics between the rotating workpiece and a rotating tool. Hard turning has long established itself as a machining method to eliminate grinding and its associated high tooling costs, refixturing of the part and relatively long processing times.

A new model of grit cutting depth in wafer rotational ...

Wafer rotational grinding is widely employed for back-thinning and flattening of semiconducting wafers during the manufacturing process of integrated circuits. Grit cutting depth is a comprehensive indicator that characterizes overall grinding conditions, such as the wheel structure, geometry, abrasive grit size, and grinding parameters.

Surface figure control in fine rotation grinding process ...

2018-6-15  Fine rotation grinding (FRG) is a typical efficient method for silicon mirror manufacture. A geometric model is developed in this paper to research silicon mirror surface figure control mechanism in FRG process. The model demonstrates the relationship between the grinding spindle obliquity and the mirror surface figure.

Rotational Turning - weisser-web

ROTATIONAL TURNING 2.0 With the rotational turning process developed and patented by WEISSER, finely machined surfaces can be generated free of twist with a precision finish, thus completely substituting costly grinding processes.

Effect of the Velocity of Rotation in the Process of ...

2016-12-1  We consider one of the processes of surface mechanical attrition treatment, namely, the technique of vibration grinding. It is based on causing surface plastic deformation in the treated part by bombarding it with flexible granular particles. This process is useful and reliable when high surface quality is required. The present work focuses on the effect of velocity on the outcomes of the ...

GRINDING PROCESS

Grinding Process Grinding is a surface finishing operation where very thin layer of material is removed in the form of dust particles. Thickness of material removed is in range of 0.25 to 0.50 mm. Tool used is a abrasive wheel Grinding machine is a power operated machine tool where, the work piece is fed

Numerical and Experimental Approach for Roll Grinding

2013-12-9  In this roll grinding process, there are additional time delay effects, which are originated from the overlap of the grinding path on the surface of the roll (the work piece) ground by a cylindrical grindstone. Generally, the grinding system may be unstable due to the delay effect and this chatter growth rate problem has been analyses widely in literature [1-9]. The grindstone’s rotational speed is high and the roll is rotating very slowly due to the requirements of the finishing process. The contact zone between the roll and the grindstone is assumed as an insignificantly small area. In the mathematic model, the roll is described as a simply supported continuous beam element expressed in an eigenvector basis and in a rotating coordinate frame. The contact between the roll and the grindstone is described by contact dynamics formulation and the normal and tangential forces of the contact are based on the wear theory. In this work, the double delays will be involved in the model. Based on the above considerations an experiment is set up on a grinding machine of a real factory. The responses of an industrial roll grinding

Rotational Moulding - an overview ScienceDirect Topics

Rotational molding is a manufacturing process of hollow articles. Figure 14.18 shows a schematic diagram of the process. The process begins with the introduction of a preweighted quantity of polymer, in either powder or liquid form, into half of a cold mold. The mold is closed and placed in an oven where it is rotated biaxially (Figure 14.18B).

Rotational grinding of silicon wafers - Sub-surface damage ...

Therefore, various methods have been studied and compared for measurement of the sub-surface damage introduced to single crystal silicon wafers during rotational grinding process.

Grinding process - summaryplanet

2018-1-18  Grinding is the process of removing metal by the application of abrasives which are bonded to form a rotating wheel. When the moving abrasive particles contact the workpiece, they act as tiny cutting tools, each particle cutting a tiny chip from the workpiece. ... Set the proper rotational work speed on the wheel head.

Rotational Turning - weisser-web

ROTATIONAL TURNING 2.0. With the rotational turning process developed and patented by WEISSER, finely machined surfaces can be generated free of twist with a precision finish, thus completely substituting costly grinding processes. Due to the simultaneous rotation of the workpiece and the tool cutting edge, machining time is reduced by up to 77 ...

Close-up of the Grinding Process on the Kitchen Device ...

Buy Close-up of the Grinding Process on the Kitchen Device with Rotational Movements. Aromatic and by websis on VideoHive. Close-up of the grinding process on the kitchen device with rotational movements. Aromatic and freshly roasted coffee...

A new model of grit cutting depth in wafer rotational

2021-6-30  Wafer rotational grinding is widely employed for back-thinning and flattening of semiconducting wafers during the manufacturing process of integrated circuits. Grit cutting depth is a comprehensive indicator that characterizes overall grinding conditions, such as the wheel structure, geometry, abrasive grit size, and grinding parameters.

Process for torque free outer circumference grinding of a ...

Process according to claim 1, wherein ratios V of the grinding disk rotational speed to the workpiece rotational speed are maintained which correspond to a general formula V=G+Z/N, wherein G, Z and N are whole numbers respectively and G is an integral part of the rotational speed ratio V which is the approximate value of the rotational speed ...

Experimental Oscillation-Assisted Cylindrical Plunge Grinding

The grinding process itself is the source of many dynamic processes that make it difficult to formalize the evaluation and description of the condition of the surface being ground. These phenomena include, among others, self-excited vibrations, which are a cause of chatter. ... grinding wheel rotational

Pocket Guide to Grinding Technique - Atlas Copco

2021-8-12  When the abrasive is applied to the workpiece, rotational speed decreases as the abrasive is held back by the torque caused by grinding action and feed force. A great deal of the energy is lost through heat. The more feed force the operator applies to the tool, the lower the rotational speed. For the simplest type of non-governed air tool ...

Frequent problems during grinding – grindaix GmbH

This generates process reliability. Grinding with the wrong process parameters. To ensure that the coolant lubricant optimally reaches the machining zone, a precise ratio between the rotational speed of the grinding wheel and the exit speed of the coolant lubricant from the nozzle needs to be set.

RPM Rotational speed of grinding wheel in revolutions per ...

List the different grinding techniques. Discuss the importance of surface finish in manufacturing. Data Collection and Analysis Write down the procedures step by step for the cylindrical grinding experiment. Write down the depth of cut, wheel speed (RPM) and show your calculation of inches per minute feed for the grinding process.

Rotational Turning Bypasses Grinding Modern Machine

2018-5-20  Rotational turning was developed to eliminate the grinding process while creating a twist-free surface on a turning machine. The starting point for development of these alternatives to conventional turning processes was the elimination of axial feed of the

D30 Grinding process monitoring based on wheel

D30 Grinding process monitoring based on wheel rotational speed : development of the new monitoring indexes November 2008 The Proceedings of The Manufacturing

Grinding process - summaryplanet

2018-1-18  Grinding is the process of removing metal by the application of abrasives which are bonded to form a rotating wheel. When the moving abrasive particles contact the workpiece, they act as tiny cutting tools, each particle cutting a tiny chip from the workpiece. ... Set the proper rotational work speed on the wheel head.

The grinding of polyethylene powders for use in rotational ...

Abstract Powders are the only form in which polyethylene is used extensively in rotational moulding. The powder characteristics are recognised as being important for the production of good quality parts, and the grinding process is a crucial step in the preparation of the powders.

(PDF) Experimental Investigation of the Grinding Force in ...

Observed under typical orbital atherectomy grinding rotational speeds of 60,000, 90,000, and 120,000rpm in a 4.8mm diameter vessel, the grinding wheel motion was a combination of a low-frequency ...

A new model of grit cutting depth in wafer rotational

2021-6-30  Wafer rotational grinding is widely employed for back-thinning and flattening of semiconducting wafers during the manufacturing process of integrated circuits. Grit cutting depth is a comprehensive indicator that characterizes overall grinding conditions, such as the wheel structure, geometry, abrasive grit size, and grinding parameters.

Process for torque free outer circumference grinding of a ...

Process according to claim 1, wherein ratios V of the grinding disk rotational speed to the workpiece rotational speed are maintained which correspond to a general formula V=G+Z/N, wherein G, Z and N are whole numbers respectively and G is an integral part of the rotational speed ratio V which is the approximate value of the rotational speed ...

Impacts of back-grinding process parameters on the ...

back-grinding process parameters on the wafer fracture strength ... strength with an increase in grinding wheel rotational speed and a decrease in grinding wheel feed rate. Also, it is found that the

Frequent problems during grinding – grindaix GmbH

This generates process reliability. Grinding with the wrong process parameters. To ensure that the coolant lubricant optimally reaches the machining zone, a precise ratio between the rotational speed of the grinding wheel and the exit speed of the coolant lubricant from the nozzle needs to be set.

A high quality surface finish grinding process to produce ...

2020-3-16  A precision grinding with electrolytic dressing process [] was applied to finish mirrors; figure 2 illustrates the experimental grinding set-up, which was developed in our previous research.A rotary surface grinder, with air hydrostatic bearings for the wheel and